YS5101 (HPCTP) – Electronic-Grade Halogen-Free Flame Retardant

Chemical Name: Hexaphenoxycyclotriphosphazene | CAS No.: 1184-10-7

Product Overview

YS5101 (HPCTP) is an advanced, high-purity, additive-type halogen-free flame retardant. Based on a highly stable cyclic phosphorus-nitrogen synergistic structure, this white crystalline powder delivers exceptional flame retardancy without compromising the structural integrity of the base polymer.

Unlike traditional liquid phosphate esters (such as BDP or RDP), YS5101 features a rigid molecular architecture that eliminates the “plasticizing effect.” This allows manufacturers to achieve stringent UL94 V-0 flame retardancy while perfectly preserving the Glass Transition Temperature (Tg) and Heat Deflection Temperature (HDT) of the material.

Key Performance Advantages

• Zero Plasticizing Effect (High Tg Retention): Maintains the mechanical rigidity and high-temperature dimensional stability of base resins, ensuring no loss in Tg or HDT.

• Exceptional Thermal Stability: With a 5% weight loss temperature (TGA) exceeding 350°C, YS5101 easily withstands the rigorous, high-temperature processing required for engineering plastics like Polycarbonate (PC).

• Electronic-Grade Purity: Featuring a purity of ≥ 99.0% and strictly controlled ultra-low chlorine content (≤ 20 ppm). This exceptional purity provides high hydrolysis resistance and prevents Conductive Anodic Filament (CAF) failures in critical electronic environments.

• Superior Dielectric Properties: Its non-polar nature ensures low dielectric constant (Dk) and low dielectric loss (Df), making it highly compatible with high-frequency signal transmission substrates.

• Eco-Friendly & Compliant: 100% Halogen-Free, TPP-Free, and PFAS-Free. Fully compliant with global RoHS and REACH environmental regulations.

Primary Applications

1. High-End Engineering Plastics (PC & PC/ABS)

YS5101 is the premier choice for transparent Polycarbonate (PC) sheets, PC/ABS alloys, and modified PPO. It achieves highly efficient flame retardancy at low loading levels while preserving the optical clarity and impact resistance essential for IT equipment, automotive interiors, and semiconductor cleanroom panels.

2. 5G Copper Clad Laminates (CCL)

An indispensable additive for high-frequency and high-speed PCB substrates, including PPE/PPO and Benzoxazine resin systems. Its supreme moisture resistance and low ionic impurities guarantee electrical reliability for 5G base stations and servers.

3. Semiconductor IC Packaging (EMC)

Widely trusted in Epoxy Molding Compounds (EMC) for large-scale integrated circuit packaging. It acts as a highly reliable replacement for traditional brominated flame retardants.

Typical Technical Properties

• Appearance: White Crystalline Powder

• Purity (HPLC): ≥ 99.0%

• Melting Point: 111 – 114°C

• Phosphorus Content: 13.40% (Theory)

• Nitrogen Content: 6.06% (Theory)

• Chlorine Content: ≤ 20 ppm

• Volatile Matter: ≤ 0.5%